NEWS

SHI becomes a silver sponsor for the Electronic Components and Technology Conference (ECTC)

April 15, 2024

Sumitomo Heavy Industries, Ltd. (SHI; Head Office: Shinagawa-ku, Tokyo; President and CEO: Shinji Shimomura; hereinafter “SHI”) has become a silver sponsor for the "Electronic Components and Technology Conference (ECTC). ECTC is an internationally significant conference in the field of semiconductor manufacturing technology. Through this sponsorship, SHI aims to contribute to the development of the semiconductor industry.

■About ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is organized by the IEEE Electronics Packaging Society (former CPMT).

ECTC Website