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Many years have passed since SiP (System in Package) was developed in order to materialize high-density system as typified by present-day mobile electric devices. We can already see in the market the electric devices, which have 5 to 9 stacked chips. As such SiPs are too complicated to keep good molding in many cases, the compression molding is grabbing people's attention in these years. The compression molding, which has less resin flow and has great advantage for filling resin to narrow space, is not only advantageous for molding SiP but also environmentaly friendly as it does waste few materials. This report describes the technical advantages of the compression molding process over the conventional molding method, and the SY-COMP system, which has enabled the compression molding process to be achieved.
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