Cutting edge packaging derived from complete knowledge of processes
This is equipment for mold forming semiconductor chips with epoxy resin and the like. The molding business at the SHI Group progressed after the business was inherited from Toshiba Corporation and NEC Corporation and now we are developing equipment with an emphasis on the processes of our customers. Furthermore, the press, which is a key component, is manufactured in-house and we are working on improving its quality. The SHI Group provides equipment optimally suited for manufacturing cutting edge packages, for which reductions in the thickness and dimensions are progressing.
This compression molding machine is optimally suited for packages of long wire, and extremely thin products. Our proprietary preform method is utilized to minimize wire deformations even with long wire products.
Multiple presses for large substrates achieve four times the productivity (compared with our products). A chip stacking detection function has been added in order to perform highly precise molding of stacked layer multi chip packages (MCP).
A high quality package is provided by maintaining clean dies, through the utilization of film assist molding. Film can be automatically set from the front, and up to a maximum of four modules can be handled. The cleaner interior of the equipment improves product quality and yield rates. Clamping capacity has also been enhanced, and the size reduced.
This technology is used for observing and recording the flow of resin inside the molding die in real time, which is ordinarily not observable. Pieces of glass are used in the cavity surface of the sealed die in order to achieve visualization of the resin flow inside the die.
We have been able to progress from a conventional static analysis, such as a short shot, to a dynamic analysis, which directly observes the flowing process, making it possible to analyze the resin flow inside the die with even more detail. Failure analysis, as well as the optimization of dies, packages, sealing conditions and materials, is possible by gaining accurate detailed information on the behavior of the resin inside the die.
|SY-COMP compression molding machine||This compression molding machine is optimally suited for packages of long wire and extremely thin products.|
transfer molding machine
|High quality packages are produced by maintaining clean dies, through the adoption of film assist molding.|
|Visual Mold Analysis System||This technology is used to observe and record the flow of resin inside the molding die in real time, which is ordinarily not observable.|