Precision Positioning Equipment

XY stage leads nanotechnology

The XY stage used to perform precise positioning of equipment for the manufacture of FPDs and semiconductors has been utilized. The mechanical structural technologies, as well as proprietary control technologies nurtured as a general machinery manufacturer are used to achieve the highly accurate positioning on a nanometer scale.

Features

GL series linear guide stage for gantry movements

  • A low cost is achieved with the use of steel frame construction.
  • The full line of products ranges from the fourth to the tenth generation.
  • A light-weight gantry has been incorporated to shorten the tact time.
  • Applications:
    XY stage for the inspection and repair of liquid crystal, solar cell and organic EL equipment.

GA series air guide stage for gantry movements

  • A high scan performance is achieved with the use of a surface plate and an air guide.
  • A unique reaction force processing mechanism reduces uneven applications (optional).
  • A head height positioning and adjustment function is available for the Z-axis mechanism (optional).
  • Applications:
    Stage for liquid crystal, solar cell and organic EL application equipment.

LA series large air guide surface stage

  • A high degree of flatness and straightness is achieved with the use of a surface plate and an air guide.
  • Stable processing is made possible with a unique table support structure.
  • Applications:
    XY stage for high precision laser processing and inkjet for liquid crystals, solar cells and organic ELs.

TL series stack-type linear guide stage

  • A stage featuring high precision and throughput is provided at a low cost.
  • A high throughput is achieved by a linear motor driven stage.
  • Highly precise positioning is achieved with the use of a unique reaction force processing mechanism.
  • Applications:
    XY stage for semiconductor and printed circuit board inspection and processing equipment.

SA/SL series compact surface stage

  • High speed stability and positioning precision is achieved through the use of an H-type structure with a low center of gravity.
  • Utilizing mounted components as optional parts makes it possible to respond to a variety of our customers' requirements.
  • The reaction force processing mechanism achieves a high precision drive during high speed acceleration and deceleration (1m/s, 1G).
  • Applications:
    XY stage for semiconductor and printed circuit board exposure and high precision inspection equipment.

Product lines

XY stage for inspection and repair
GL Series
High speed positioning of the head
Multiple processing heads can be mounted
Supports partitioning of the equipment
XY stage for coater
GA Series
A high speed scan coating is made possible
The stage structure prevents uneven application
Adjustable head height position
XY stage for high precision laser processing and inkjet
LA Series
Optimally suited for the high precision positioning of substrates and processing heads
Multiple processing heads can be mounted
Supports partitioning of the equipment
XY stage for inspection and processing system
TL Series
High speed positioning of wafers and substrates
Equipment vibrations are reduced to a minimum
Optional Z-framing and θ-framing
XY stage for semiconductor and printed circuit board exposure and high precision inspection equipment
SA/SL Series
Optimally suited for the high speed scanning of wafers
Equipment vibrations are reduced to a minimum
Optional Z-framing and θ-framing

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