SUMITOMO HEAVY INDUSTRIES TECHNICAL REVIEW
Analysis Method on Chatter Mechanism of Surface Grinding Machine
Kouichi ICHIHARA and Hironobu ISHIDA

Analysis Method on Chatter Mechanism of Surface Grinding Machine

The chatter mark problem associated with surface grinding machines has so far been dealt with only on a trial-and-error basis due to the difficulty in cause identification stemming from the measurement challenges and diversely presumed causes. In this paper first shown is the effectiveness of the measurement of undulations that appear on the ground surface, combining laser-based displacement measurement and FFT analysis as the chattering mark examination tool. Also introduced is the chattering mark visualization device with a sensitivity better than naked eyes using an infrared heater and camera. Next clarified is the mechanism of the chattering mark to appear through the undulation generated on the work surface. As a matter of fact this work surface undulation is to be created by the surface form of grinding wheel that has gone through a dressing process, and which is considered to be a cause that leads most frequently to generating the chatter mark as for the planer grinding process with the general-purpose grinding wheel. At last shown is the chattering amplitude that occurs due to the relative vibration of work piece and grinding wheel of the order of 0.5 mm.